Wet Etch & Electroplating Wafer Engineering Technician (night Shift)

Wet Etch & Electroplating Wafer Engineering Technician (Night Shift)

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we've been doing just that—our technology helped people put a man on the moon and capture the first-ever picture of a black hole.

We offer an expansive portfolio of technologies, HDDs, and platforms for business, creative professionals, and consumers alike under our Western Digital®, WD®, WD_BLACK™, and SanDisk® Professional brands.

We are a key partner to some of the largest and highest-growth organizations in the world. From enabling systems to make cities safer and more connected, to powering the data centers behind many of the world's biggest companies and hyperscale cloud providers, to meeting the massive and ever-growing data storage needs of the AI era, Western Digital is fueling a brighter, smarter future.

Today's exceptional challenges require your unique skills. Together, we can build the future of data storage.

Job Description

Essential Duties And Responsibilities:

• Perform daily job duties to provide engineering support in Wet Etch and Electroplating area.
• Basic understanding of different electroplating bath chemistry in order to request necessary bath adjustment if needed.
• Perform basic operation of different wet etch, electroplating, metrology and inspection tools in both manual and automatic mode.
• Perform non-standard process and can create or edit process recipe as well as create or edit wafer level CRMS.
• Good understanding of SPC chart and how to react to different violations according to SPEC/OCAP as well as analyzing the Electroplating process/tool performance using basic knowledge in statistics and data analysis.
• Disposition hold wafer according to SPEC or disposition criteria provided by Process Engineer. Also capable of dispositioning hold wafer with own judgement based on risk assessment, process expertise or related previous experience.
• Basic knowledge of IT-related application and software such as CRMS, APC, MITECS, GS3, TSD report, EDCSPC, SPC chart, Fabtime, etc.
• Notify Process Engineer and Manufacturing team if there's any suspected excursion. Do preliminary investigation, identify and hold all potentially affected wafers to contain the problem and minimize the impact.
• Train wafer fab operators with new process or tool.
• Lead and support team project.

Qualifications

Required:

• 5 or more years wafer manufacturing hands-on experience.
• Must have strong computer skills, including knowledge of Windows and proficiency with Microsoft Excel.
• Must be a self-starter and quick learner.
• Must be able to solve problems and troubleshoot minor process and equipment related issues.

Preferred:

• Preferred AA Degree.