Engineer Microelectronic Semiconductors - Apopka FL

Microelectronics Semiconductor Product Engineer

Northrop Grumman Mission Systems is seeking an experienced and motivated Microelectronics Semiconductor Product Engineer for our Advanced Packaging Technology facility in Apopka, Florida. For more than 70 years, Northrop Grumman's Microelectronics Center has pushed the boundaries in this ever-evolving field of microelectronics. Our two U.S.-based government-trusted foundries and state-of-the-art packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.

The Microelectronic Semiconductor Product Engineer will analyze wafer probe test electrical data, track/monitor program metrics (delivery & yield), investigate and resolve technical issues as part of a cross-functional team, and lead team efforts to drive cost and schedule improvements. The selected candidate engineer will work closely with program managers, functional engineering staff (product, test, assembly, design, process, quality), and operations, serving as the engineering POC for any product-related technical and production issues.

The selected candidate must have excellent verbal and written communication skills; be able to multi-task in a fast-paced, dynamic, and high-visibility environment; and work well as part of a team. Position will demand large amounts of time working in a cleanroom environment. Some lifting and standing will be required.

Responsibilities include, but are not limited to, the tasks outlined below:

• Problem-Solving: Drive process improvements for yield, reliability, and cost volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills.
• Lead Root Cause and Corrective Action (RCCA) task forces to troubleshoot and develop solutions that prevent recurrence for excursion incidents using 8D problem solving methodologies
• Quality Control: Execute strategic projects for improvement of sustaining operations through monitoring statistical process control (SPC) charts and disposition of out of spec material.
• Support process control, planning, safety, and quality organizations to ensure the equipment meets cost, quality, safety, and reliability metrics.
• Use Failure Mode and Effects Analysis (FMEA) to assess and mitigate risk for critical processes, process modules, and tools.
• Documentation & Data Systems: Maintain accurate records and produce detailed reports for all data analysis and investigations performed.
• Support engineering data analysis including metrology data, ERP and MES data, and other in-process metrics.