Advanced Packaging Development Engineer
USA Jobs
Expert In Advanced Packaging Technology Development
We are hiring an expert in advanced packaging technology development, with at least 15 years experience in 2.5D / 3D packaging related development work. Project management and team work skills are required. Strength in technology innovation, development, and enablement are key factors to consider.
A Ph.D. degree in related engineering field is preferred.
Compensation and Benefits
The annual base salary range for this position is $127,100 - $203,400. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.