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SR MFG & Process DVL Engineer

Own mold design and process development for high-throughput injection molding programs
Dongguan, Guangdong, China
Senior
23 hours agoBe an early applicant
TE Connectivity

TE Connectivity

Designs and manufactures connectivity and sensor solutions that enable power, data, and signal transmission in harsh and demanding environments.

1 Similar Job at TE Connectivity

Sr Mfg & Process Dvl Engineer

Implements manufacturing techniques, processes, tools, and machinery to maximize throughput; performs research on products and manufacturing processes and shares the same with senior engineers.

Bachelor of Science or above degree and engineering background. More than 8 years Mold design, Process and Troubleshooting knowledge / experience. Good team work and communication skills (for TE internal and Outside suppliers). Strong knowledge of tool fabrication, tool-steel application/selection, heat treating, and plating/coating. Strong knowledge of injection molding processes (Injection, Over-molding, two-shot, etc.). Strong understanding of plastic, injection machine, auxiliary equipment (strip feed, camera, etc). Good at Mold flow simulation and analysis. Familiar with BTI 5-Step process, and Knowledge of SIM (Scientific Injection Molding). Understand tolerance calculations and Geometric Dimensioning and Tolerancing. Good project management skill – Ability to work on several projects at once. Effective prepare and present Technical knowledge within a group setting. Knowledge of quality control, PFMEA. Good trouble shooting skill – Investigation of failure mode, Analysis root cause, Make corrective actions, Follow up the action result, as FACA cycle. Willingness to travel (25% travel). Ability to effectively communicate in English – Written and Spoken.

Job Locations: NO.1 TYCO ROAD, HOUJIE INDUSTRIAL CITY DONGGUAN, Guangdong 523071 China

Travel Required: 10% to 25%

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SR MFG & Process DVL Engineer
Dongguan, Guangdong, China
Engineering
About TE Connectivity
Designs and manufactures connectivity and sensor solutions that enable power, data, and signal transmission in harsh and demanding environments.