✨ About The Role
- The role involves sustaining wafer probe equipment to test the electrical properties of superconducting quantum circuits.
- The engineer will develop and deploy new test programs and functions in a production environment.
- Responsibilities include troubleshooting and resolving issues related to probe equipment and test procedures.
- The engineer will take ownership of assembly and packaging equipment and processes, including die attach and wire bonding.
- The position requires creating specifications and documenting processes for production deployment.
⚡ Requirements
- The ideal candidate will have a disciplined hands-on approach to development work and technical problem solving.
- A Master's degree or Ph.D. in a Science or Engineering field is highly preferred for this role.
- Candidates should possess at least 3-7+ years of hands-on experience with semiconductor/MEMS e-test, assembly, and packaging tools.
- A strong understanding of semiconductor fabrication processes and electrical measurement instrumentation is essential.
- Good communication skills are necessary to effectively collaborate with cross-functional teams.