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4th Shift Backside And Die Visual Support Engineer

Support backside wafer processes for gallium arsenide and III-V semiconductor fabrication
Andover, Massachusetts, United States
Senior
18 hours agoBe an early applicant
Raytheon

Raytheon

A leading aerospace and defense company providing advanced systems and services for commercial, military, and government customers worldwide.

Fourth Shift Backside And Die Visual Process Support Engineer

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat. Our team solves tough, meaningful problems that create a safer, more secure world.

The Advanced Microelectronics Solutions (AMS) Department has an exciting opportunity available for Fourth Shift Backside And Die Visual Process Support Engineer to join the deposition processes production work center working on gallium arsenide, gallium nitride, and III-V focal plane array fabrication within the Advanced Microelectronics Solutions (AMS) Department. This role requires a basic understanding of microelectronics processing techniques such as deposition, photolithography, and etch but will primarily concentrate responsibilities in wafer bonding, wafer debonding, grind/thinning, singulation (saw and scribe), die inspection, die pick, and automated die inspection.

As a member of the AMS Department, the individual will be responsible for supporting backside related processes used to fabricate semiconductor products in the Andover foundry. Duties include coordinating with fab operation leads on the shift, communicating with engineering support on other shifts through pass-downs, training manufacturing personnel, reviewing lots and wafers requiring special disposition, failure analysis of tools and processes, supporting work center leads in tool and process qualification efforts, looking for ways to reducing rework and scrap, and looking for ways to increase efficiency in the process line.

A significant portion of the role involves communicating with the manufacturing personnel, equipment teams, cell leads, and engineering leads to ensure the work center has the necessary resources to function efficiently. As the fourth shift process support engineer, communication of issues and status to other shifts is also critical to provide everyone with the information need to execute effectively. Presence on the manufacturing floor is required for quick resolution of issues and quick reaction time to prevent interruption to customer commitments.

The ideal candidate will have a working understanding of microelectronics processing techniques such as bond, debond, singulation, die pick, and die inspection, be an excellent communicator, and have a drive to learn and improve the areas in which they work. Ability to multitask with attention to detail, maintain organized and documented processes, and the ability to work well in small cross-functional teams is essential.

This role will be 100% on-site and based in Andover, MA.

What You Will Do:

  • Fourth shift requires onsite presence Fri/Sat/Sun 5am to 5pm
  • Processing wafers to create III-V semiconductor devices in a cleanroom environment
  • Work autonomously with limited oversight
  • Influence others regarding policies, practices, and procedures.
  • Review and disposition wafers on hold for evaluation in the work center
  • Work well in small, cross-functional teams, assist in maintaining or improving production processes.
  • Actively communicate with parties within and outside of the work center (off-shift engineers, work center leads, operation leads, manufacturing personnel, equipment team, etc.)

Qualifications You Must Have:

  • Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 5 years of experience including experience working in a cleanroom environment, experience with semiconductor processing techniques such as optical microscope inspections, wafer bonding/thinning, singulation, photolithography, dry etching, and metals evaporation
  • The ability to obtain and maintain a US security clearance. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance.

Qualifications We Prefer:

  • A degree in Science, Technology, Engineering, or Mathematics (STEM)
  • Clearly and succinctly document and present process development status in meetings
  • Semiconductor equipment operation and/or maintenance
  • Knowledge related to semiconductor processing and data analysis
  • Experience utilizing data analysis software packages (e.g. MATLAB, Python, SQL, JMP)
  • Experience with quality standards and audits

What We Offer:

Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation.

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4th Shift Backside And Die Visual Support Engineer
Andover, Massachusetts, United States
Engineering
About Raytheon
A leading aerospace and defense company providing advanced systems and services for commercial, military, and government customers worldwide.