At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat. Our team solves tough, meaningful problems that create a safer, more secure world.
The Advanced Microelectronics Solutions (AMS) Department has an exciting opportunity available for Fourth Shift Backside And Die Visual Process Support Engineer to join the deposition processes production work center working on gallium arsenide, gallium nitride, and III-V focal plane array fabrication within the Advanced Microelectronics Solutions (AMS) Department. This role requires a basic understanding of microelectronics processing techniques such as deposition, photolithography, and etch but will primarily concentrate responsibilities in wafer bonding, wafer debonding, grind/thinning, singulation (saw and scribe), die inspection, die pick, and automated die inspection.
As a member of the AMS Department, the individual will be responsible for supporting backside related processes used to fabricate semiconductor products in the Andover foundry. Duties include coordinating with fab operation leads on the shift, communicating with engineering support on other shifts through pass-downs, training manufacturing personnel, reviewing lots and wafers requiring special disposition, failure analysis of tools and processes, supporting work center leads in tool and process qualification efforts, looking for ways to reducing rework and scrap, and looking for ways to increase efficiency in the process line.
A significant portion of the role involves communicating with the manufacturing personnel, equipment teams, cell leads, and engineering leads to ensure the work center has the necessary resources to function efficiently. As the fourth shift process support engineer, communication of issues and status to other shifts is also critical to provide everyone with the information need to execute effectively. Presence on the manufacturing floor is required for quick resolution of issues and quick reaction time to prevent interruption to customer commitments.
The ideal candidate will have a working understanding of microelectronics processing techniques such as bond, debond, singulation, die pick, and die inspection, be an excellent communicator, and have a drive to learn and improve the areas in which they work. Ability to multitask with attention to detail, maintain organized and documented processes, and the ability to work well in small cross-functional teams is essential.
This role will be 100% on-site and based in Andover, MA.
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Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation.