Staff Mechanical/thermal Design Engineer

Staff Mechanical/Thermal Design Engineer

Qorvo is looking for an experienced Staff Mechanical/Thermal Engineer to join the Defense & Aerospace product development team. The successful candidate will lead mechanical design and development efforts of RF power amplifiers for defense communications, radar and electronic warfare applications.

Responsibilities:

• Staff level Mechanical/Thermal Engineer developing next generation microelectronic packaging technology with emphasis on thermal analysis
• Chosen candidate will work closely with select team of IC designers, circuit designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forward
• Using FEA and other industry standard simulations tools:
• Perform detailed modeling and optimization of thermal design at the die/package/board level
• Perform mechanical stress modeling and optimization at the die/package/board level
• Develop and execute thermal measurement techniques to support analysis for internal and external customers
• Guide package and substrate design decisions that meet performance specifications and yield requirements
• Supervise and respond to manufacturing issues as they occur
• Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trends
• Support external customers with applications thermal models and failure analysis support

Qualifications:

• BSME/MSME degree in mechanical engineering or other relevant field with a minimum of 8 years' experience in semiconductor packaging
• Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries
• Expert level skill with ANSYS and Solidworks, or similar
• Knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies
• Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow
• Knowledge of microelectronic inspection tools and equipment including capabilities and limitations. Similar knowledge of failure analysis techniques and equipment
• Knowledge of reliability calculation methods for semiconductors
• Understanding of GD&T, ANSI standards and tolerance stack-ups required
• Demonstrated ability to work with cross-functional teams
• Excellent verbal communication and interpersonal skills
• Excellent written communications skills

This position is not eligible for visa sponsorship by the Company.

Nearest Major Market: Dallas

Nearest Secondary Market: Fort Worth