Lead imager package product design activities including schematic and package netlist definition; package circuit layout; package simulations; package design review and approval; and package product performance verification.
Provide direct design support for imager package product designs including wire bond BGA/LGA/PGA, MCP (multichip package), flip chip package and WLCSP (wafer level chip scale package).
Work directly with Product Design, Design Integration, Product Engineering, Test Engineering, Applications Engineering, Hardware Development, Marketing, Packaging R&D, Packaging NPD, Purchasing, OSAT's, and key package material suppliers.