We are looking for a Process Engineer role in preparation for the formation of the joint venture of NXP and VIS, known as VSMC.
Job Description
This posting is for a Principal Etch Process Engineer in a high volume, 300mm wafer manufacturing environment. The Senior Deep Trench Etch Engineer is responsible for the optimization and sustaining of deep trench etch processes used in advanced semiconductor device fabrication. This role involves working with plasma etch tools driving process improvements, and collaborating with cross-functional teams to ensure high yield, reliability, and manufacturability of deep trench structures.
Primary Responsibilities:
Required Skills/Experience: