Senior Packaging Development Engineer

Packaging Development Engineer

Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize electrical assembly and RF signal efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!

Your Responsibilities

• Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met.
• Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, etc…
• Optimize the assembly of electrical and optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
• Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
• Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
• Drive package debug activities during product validation and qualification.
• Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.

Your Skills and Experience

You have:

• 5-8 years of experience in high-speed electronics and Silicon Photonics package design.
• Experience with flip chip, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, die attach.
• Experience in microelectronics, optoelectronics packaging design and assembly.
• Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
• Experience in high-volume packaging of optical transceivers, co-packaged optics, multi-chips module, pluggables, 2.5/ 3D packages.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
• Experience with package and process design/development from design to production.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.

It would be nice if you also have:

• Familiar with optical coupling, fiber pigtail and free space optics.
• Knowledgeable in materials properties and process, yield analysis and enhancement, failure mode and analysis, quality tools (such as DOE, SPC and Six-Sigma process and analysis).
• Familiar with Industry Test Standard, such as JEDEC, EIA, Telcordia, Mil-Std, etc.
• Knowledge of material properties and associated mechanical part fabrication processes.

More Information

• Corporate Retirement Savings Plan
• Health and dental benefits
• Short-term disability, and long-term disability
• Life insurance, and AD&D – Company paid 2x base pay
• Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
• Paid time off for holidays and Vacation
• Employee Stock Purchase Plan
• Tuition Assistance Plan
• Adoption assistance
• Employee Assistance Program/Work Life Resource Program

The above benefits exclude students. Disclaimer for US/Canada Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role. All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.

About Us

Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we're advancing connectivity to secure a brighter world.

Learn more about life at Nokia.

Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you're interested in this role but don't meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.

Job Info

• Job Category Applied R&D
• Degree Level Master's degree
• Job Schedule Full time
• Job Type Experienced
• Job Identification 35754
• Role Type Individual contributor
• US/Canada Salary Range US Annual Base Salary Range * $ 159,782.61 -296,739.13 USD *Plus, potential incentive/variable compensation for eligible roles Canada Annual Base Salary Range * $ 135,000.00- 180,000.00 CAD *Plus, potential incentive/variable compensation for eligible roles
• Experience level Experienced
• Locations 520 Almanor Avenue, Sunnyvale, California, 94085-3533, US 600 March Road, Ottawa, Ontario, K2K 2E6, CA (Hybrid)