HBM SIPI, Principal Engineer

Senior Si/Pi Technical Authority

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are part of the Heterogeneous Integration Group within Technology and Products, where we build High Bandwidth Memory solutions that power AI and ML platforms. Our team works at the edge of what's possible, stacking and integrating advanced silicon technologies to deliver industry-leading bandwidth, density, and power efficiency. We move fast, solve hard problems, and set technical direction others follow!

This role sits at the center of next-generation HBM development. As a senior SI/PI technical authority, you will shape system-level decisions that directly impact performance, reliability, and scalability across multiple product generations. If you enjoy deep technical ownership, complex problem solving, and influencing architecture from concept to sign-off, this role offers both challenge and impact.

Responsibilities:

• Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency- and time-domain evaluation
• Define and drive power delivery architecture, impedance targets, and transient analysis
• Perform electromagnetic extraction and modeling across PCB, package, and interposer designs
• Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs
• Provide clear technical direction in ambiguous or incomplete design environments

Minimum Qualifications:

• 7 years of experience in signal integrity and power integrity modeling and analysis
• Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design
• Hands-on experience with industry-standard SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight

Preferred Qualifications:

• 10+ years of experience in SI and PDN modeling and analysis
• Experience with 2.5D/3D advanced packaging technologies such as interposer-based designs
• Background working with high-bandwidth interfaces including HBM, DDR, SERDES, or UCIe
• Direct ownership of system-level SI/PI sign-off for production silicon
• Scripting experience with TCL and/or Python to automate SI/PI analysis flows

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$175,000.00 - $309,000.00 a year

Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.