Global Quality IC Package Design/development Quality Assurance Principal Engineer

Gq Package Design/Development Quality Assurance (Pkg Ddqa) Principal Engineer

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron's Global Quality (GQ) organization ensures the highest standards of quality and reliability for advanced memory solutions. Our team collaborates with Technology Development, Engineering, and customer-facing groups to mitigate risks, drive innovation, and uphold industry-leading standards through rigorous testing, analysis, and continuous improvement.

Position Overview

As a GQ Package Design/Development Quality Assurance (Pkg DDQA) Principal Engineer at Micron Technology Inc., you will be responsible for the quality and reliability of new IC package technology introductions. This role focuses on advanced memory solutions, ensuring Chip-Package Interaction risks are understood and mitigated prior to New Product Introduction. You will act as a subject matter expert, lead root cause analysis, support customer engagements, and contribute to industry standards while mentoring and advancing technology through innovative solutions.

Responsibilities

• Execute technical risk assessment and NUDD (New, Unique, Different, Difficult) analysis for new designs/design rules and lead risk mitigation execution.
• Develop holistic qualification plans and coordinate execution.
• Provide recommendations on releasing new package technologies based on test results and technical risk assessments.
• Serve as SME for problem-solving related to package technology, ensuring effective root cause analysis and corrective/preventive actions.
• Collaborate with customer-facing teams to draft and present content addressing customer issues and requests.
• Represent Micron's interests in industry standards bodies such as JEDEC and AEC.
• Provide SME support and mentoring to elevate package reliability engineering knowledge across the company.

Minimum Qualifications

• Master's degree or equivalent experience in Electrical/Electronics, Mechanical, Material Science and Engineering, Physics, or related field.
• 7+ years of experience in semiconductor package design, manufacturing, or Quality & Reliability (Q&R).
• Experience with advanced packaging technologies (e.g., 3DI, Wafer-2-Wafer, SiP).
• Expert-level applied knowledge of package-level and board-level reliability test methods, reliability acceleration modeling, and sampling statistics.
• Expert-level understanding of Chip-Package Interaction and effects of thermomechanical and hygroscopic swelling stresses on reliability.
• Thorough knowledge of semiconductor package designs, assembly processes, and board-level reliability challenges.
• Understanding of mechanical and material interaction effects on IC component and PCB assembly reliability.
• Knowledge of statistics and quality management tools (SPC, FMEA, 8D CAR).
• Self-motivated, detail-oriented, and able to work independently with strong analytical and multi-tasking skills.
• Excellent written and verbal communication skills in English.

Preferred Qualifications

• Ability to mentor and publish technical papers (internal and external).
• Experience collaborating with industry standards bodies and driving beneficial changes.
• Strong problem-solving skills and ability to interact effectively with cross-functional teams.