Packaging Engineer

Photonic Ai Product Manager

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

In this role you will utilize your in-depth process engineering and partner/OSAT management experience to drive company's Photonic AI products from concept to high volume manufacturing. You will be responsible for managing and driving the assembly process technology development in close collaboration with foundries and OSATs to ensure design for manufacturing, reliability, and cost. Responsibilities will include identification and mitigation of risk to new technologies used in product integration and ensure factory readiness through maturing product during the NPI phase. This job will require you to have hands-on experience in wafer process development, working with consumable suppliers, Interposer based co-packaged optics advanced assembly process development along with strong project management, written and verbal communication skills. Also required for the job is a can-do attitude to prioritize and address issues with a high sense of urgency.

Work with cross-functional packaging teams and lead process development at OSAT along with 2.5D/3D CoW process development with particular emphasis on Advanced packaging integration and module experience.

Drive OSAT logistics and monitor Lot movement through OSAT

NPI readiness

Track Inventory management at OSAT

Actively manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints

Manage internal and external resources effectively and efficiently towards established corporate milestones

Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI

Drive OSAT to meet cycle time, yield and reliability to meet our shared goals for new Co-Packaged Optics Products

10+ years of experience in Semiconductor Packaging, Process and Technology Development

Expert level understanding of Packaging/assembly/substrate across various package technologies is required

Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects with TSVs in various 2.5D/3D package form factors

Hands on experience working as integration and/or Process engineer at OSATs is required

Working level understanding of cross-functional packaging areas: package architecture, design rules, BOM, enabling material/process technologies, mechanical, design for manufacturing, reliability, and cost

Familiarity with component & system level reliability, testing, and FA

Experience with photonics packaging will be preferred but is not necessary

Experience in project management and communicating technical and project/program status and issue resolution at the executive level

Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability

Effective communicator and comfortable engaging with internal cross functional teams as well as domestic and overseas suppliers

Excellent attention to detail, process and operationally oriented and self-driven with the ability to work independently and take projects to completion with minimum supervision

M.S or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry or Physics is required

Fluent in both Korean and English language