Marvell's Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond.
The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances.
The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements.
The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We're dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us.