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Central Engineering works directly with the Optical Digital Signal Processing (ODSP) group to design physical layer ICs for high-speed fiber optic data communication, such as Transimpedance Amplifiers (TIAs), and drivers for Silicon Photonic (SiPho) and discrete Electro-absorption Modulators (EAMs) and Mach-Zehnder Interferometer Modulators (MZMs). This group is the market leader in delivering DSP transceivers that support 10Gbps to 1600Gbps systems. We address the bandwidth, capacity and power issues faced by cloud computing and mega data center networks. Our world class group leverages our core competencies in advanced circuit design to solve the world's ever-increasing desire to transmit more data for less power with fewer errors. We are continually first to market in Data Center, Metro and Long-Haul applications. As a member of the design group, the candidate will be responsible for design and validation of FET and BiCMOS circuits for high-speed broadband ICs that serve these applications.
Minimum Requirements: