Senior Packaging Engineer - System - in - package (hybrid / Remote)

Senior Packaging Engineer

Littelfuse is one of America's Best Mid-Sized Companies (Forbes) and has been named one of the Best Places to Work in Illinois (Best Companies Group) for 11 consecutive years. With its global headquarters in Chicago, Illinois, USA, Littelfuse is a leading, global manufacturer of electronic components serving more than 100,000 end customers across industrial, transportation, and electronics end markets. We have more than 17,000 employees with operations in 15 countries. From semiconductors to sensors… switches to fuses and more… we produce billions of electronic components that help our customers empower a sustainable, connected, and safer world. In 2021, Littelfuse had net sales of $2.1 billion.

Join the Littelfuse team driving innovation in solid-state protection and control systems. As a Senior Packaging Engineer, you will lead the design, development, and qualification of advanced System-in-Package (SiP) solutions that integrate power semiconductor devices, passive components, and interconnects. This is an ideal role for a self-motivated engineer who thrives in ambiguity, enjoys technical challenges, and is passionate about delivering high-performance, reliable solutions.

Design & Development

• Architect and develop SiP solutions for solid-state control and protection systems.
• Perform stress and tolerance analyses; create detailed 3D models and engineering drawings.
• Evaluate and select materials including substrates, die attach, underfills, encapsulants, and thermal interface materials.

Collaboration & Execution

• Partner with cross-functional teams to assess technical feasibility and identify suitable suppliers.
• Work with contract manufacturers and internal teams to transition designs into production.
• Prepare and maintain comprehensive design documentation.

Simulation & Reliability

• Define and interpret multi-physics simulations (thermal, electrical, mechanical) to predict lifetime performance.
• Ensure designs meet performance, reliability, and cost targets through rigorous evaluation.

Project Leadership

• Provide regular updates on project status, milestones, and deliverables.
• Support occasional travel to evaluate suppliers and assist with production ramp-up.

About You

• MS in Mechanical Engineering, Physics, or Materials Science (or BS with equivalent experience).
• 10+ years of hands-on experience in semiconductor IC packaging, with a focus on SiP development.
• Expertise in flip chip bonding, interposer design, and substrate layout.
• Strong understanding of thermal management, signal integrity, and power integrity in package design.
• Experience with high-voltage isolation techniques, reliability planning, and design for manufacturing.
• Entrepreneurial mindset with a willingness to experiment, take initiative, and navigate ambiguity.

Littelfuse strives to empower associate growth and development in a culture of ongoing collaboration and respect for diverse global perspectives and expertise. Our Core Values – Respect, Customer Focus, Agility, and Collaboration – support us on our mission to improve the safety, reliability, efficiency, and performance of our customers' products and systems.

We are an equal opportunity employer that takes pride in giving every associate the means and courage to make a difference – everywhere, every day.