Senior Application Engineer
Arkansas Staffing
IC Packaging Technical Assessment
Review customers device and collaborate with the engineering team on IC packaging technical assessment, SiP (System-in-Package) module and substrate design, feasibility study, risks, and propose resolutions to meet the specific application needs. Develop new package and process qualification programs together with customer and factory engineering team, qualifying DBG/SDBG (Dicing Before Grinding /Stealth Dicing Before Grinding) process for advanced node wafer sawing. Define DOEs for new material selection, risk assessment, process optimization to meet thermal, mechanical and electrical technical requirements. Work with factory and customers in troubleshooting field related issues, maintain quality of existing packages for all product groups utilizing various destructive and nondestructive failure analysis tools such as X-ray, SAT (Scanning Acoustic Tomography), Cross-Section, SEM (Scanning Electron Microscope), FTIR (Fourier Transform Infrared Spectroscopy). Collect customers product and technical roadmaps for process engineering and RandD groups to develop advanced packages.