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Package Design Engineer
Design high-performance package structures for advanced ASICs in AI and 5G applications.
Austin
Expert
$107,000 - 190,000 USD / year
1 month ago
✨ About The Role
- This role involves overall design responsibility for ASIC package designs, focusing on aspects such as signal integrity, power integrity, and manufacturability.
- The candidate will be expected to manage project schedules and prioritize tasks across multiple projects.
- The position requires contributing to efficiency improvements within the design group.
- The job includes interfacing with customers and managing design projects from conception to completion.
- The candidate will work on complex flip-chip-BGA packages for high-performance ASICs used in AI, networking, and 5G technologies.
âš¡ Requirements
- The ideal candidate will have a strong background in electrical engineering or a related field, with a minimum of 8 years of experience in flip-chip-BGA package design.
- A deep understanding of high-speed SerDes and package-level signal integrity is essential for success in this role.
- The candidate should possess excellent self-management and organizational skills to handle multiple projects simultaneously.
- Experience with Cadence APD or equivalent package layout CAD tools is highly preferred.
- The successful individual will be a collaborative team player, able to work effectively across different time zones with internal and external designers.
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