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Package Design Engineer

Design high-performance package structures for advanced ASICs in AI and 5G applications.
Austin
Expert
$107,000 - 190,000 USD / year
2 months ago

✨ About The Role

- The Package Design Engineer will be responsible for the overall design of ASIC package designs, focusing on signal integrity, power integrity, manufacturability, reliability, and thermal aspects. - The role involves collaborating with a global R&D team to develop high-performance package designs for ASICs used in AI, networking, HPC, and 5G base stations. - The engineer will contribute to the design of critical structures for SerDes, ADC/DAC, and DDR, ensuring high-speed performance. - The position requires effective communication and cooperation with internal team members and external vendor designers across multiple time zones. - The engineer will also be tasked with identifying and implementing efficiency improvements within the design process.

âš¡ Requirements

- The ideal candidate will have a strong background in flip-chip BGA package design, particularly with high-speed SerDes. - A minimum of 8 years of experience in the relevant field is required, showcasing a deep understanding of package-level signal integrity and power integrity. - Proficiency in Cadence SKILL for Allegro or similar design-automation coding is essential, with a preference for candidates with 3 or more years of experience. - Strong project management skills are necessary, as the role involves scheduling, prioritizing, and tracking work across multiple projects. - The candidate should possess excellent self-management and organizational skills to thrive in a collaborative, worldwide team environment.
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Package Design Engineer
Austin
$107,000 - 190,000 USD / year
Engineering
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