Process Development Engineer - Back End Of Line

Process Development Engineer

Atomic Semi is building a small, fast semiconductor fab. It's already possible to build this with today's technology and a few simplifications. We'll build the tools ourselves so we can quickly iterate and improve.

We're building a small team of exceptional, hands-on engineers to make this happen. Mechanical, electrical, hardware, computer, and process. We'll own the stack from atoms to architecture. Our team is optimistic about the future and we want to continue pushing the limits of technology.

Smaller is better. Faster is better. Building it ourselves is better.

Atomic was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years.

About the Role

As a Process Development Engineer at Atomic Semi, you'll bridge the critical interface between BEOL processing and advanced packaging, developing novel integration schemes for next-generation semiconductor devices. We're looking for someone with hands-on experience in interconnect metallization, dielectric processes, or chip-to-package connections, combined with an eagerness to push beyond conventional approaches. You'll need to digest complex technical literature while translating nanofabrication fundamentals into practical process solutions.

This is a high-ownership role with lots of autonomy in a fast-moving startup environment. You'll have the opportunity to contribute to novel R&D processes and influence tool design. Candidates should have hands-on cleanroom experience and a track record of developing nanofabrication recipes from scratch, ideally across multiple process steps.

Responsibilities

• Develop and optimize bond pad structures (e.g., UBM, RDL pads, and other interconnect schemes) for advanced packaging applications
• Characterize material interfaces using SEM, EDX, and electrical testing to ensure reliable chip-to-package connections
• Generate process specifications and transfer recipes from R&D to production
• Collaborate with packaging team to troubleshoot issues related to BEOL structures
• Analyze failure modes at the BEOL-package interface and implement corrective actions

Required Experience

• PhD in Materials Science, Chemical Engineering, Electrical Engineering, or related field (or MS with 2+ years relevant experience)
• Hands-on experience with at least one BEOL process: interconnect metallization, dielectric deposition, UBM, or bond pad fabrication
• Understanding of chip attach processes and their interaction with BEOL structures
• Experience with material characterization techniques (SEM, cross-sectioning, electrical testing)

Nice-to-Have

• Experience with flip-chip, WLCSP, or advanced packaging technologies

We're an early-stage hardware startup with solid funding, world-class advisors, and a lab/office in San Francisco, CA.

Compensation: Atomic Semi is committed to fair and equitable compensation practices. The annual salary range for this role is $117,000 – $188,000. Compensation is determined based on your qualifications and experience. Our total compensation package also includes generous equity in Atomic Semi.

Benefits: Atomic Semi offers the following benefits, subject to applicable eligibility requirements:

• Medical, Dental, and Vision insurance
• Generous Paid Time Off inclusive of Holidays and Sick Time
• Visa Sponsorship
• Life and Disability Insurance
• Paid Parental Leave
• 401(k) retirement plan
• Weekly Learning & Development opportunities
• Commuter Benefits including Parking and Late Night Uber rides from the office
• Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts

We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses.

Export Control Analysis: This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant's capacity to serve in compliance with U.S. export controls.