Packaging Module Development Engineer

Job Posting

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.

Job Title

Packaging Module Development Engineer

Job Description

The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:

• Provide mechanical modeling support for a variety of R&D projects ranging from Pathfinding, Technology Development, and High-Volume Manufacturing (HVM) issue resolution.
• Work with Equipment and Process Engineers to define problem statement and boundary conditions. Apply expertise to conduct theoretical analysis and/or numerical modeling to find solution path. Seek opportunities to improve equipment design and process definition.
• Projects covering First Level/Second Level Interconnect (FLI/SLI), Thermal solutions, and SMT/PCB technologies to support Intel's future packaging platforms.
• Keep up with latest development in computational mechanics field. Continue to seek opportunities to improve modeling capability and methodology related to semiconductor packaging applications.
• Engage with engineers of different job roles and different process steps to have broader understanding of semiconductor packaging technologies.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

+ Ph.D. degree in Applied Mechanics, Mechanical Engineering, Aerospace Engineering, Civil Engineering, or related STEM field.

+ 8+ years of experience in computational mechanics. (mechanical modeling / thermo-mechanical modeling)

+ 8+ years of experience with commercial FEA software. (Ansys / Abaqus)

Preferred Qualifications

+ Understanding in both solid/fluid mechanics theory and experimental mechanics.

+ Able to convert real world problems into mechanical models.

+ Understanding of semiconductor fabrication processes and technology with technical and analytical skills

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Additional Locations

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers — from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Annual Salary Range

Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.