Opto - electronics Assembly Engineer

Meet Arago and the Aragonians

Arago is an AI and computer hardware company whose mission is to drive the course of history forward. We do so by accelerating breakthroughs at the intersection of AI and semiconductors.

Founded in 2024 by AI researchers and physicists with deep expertise in photonics, electronics, software, mathematics, and machine learning, Arago brings together a lean team of engineers and scientists from the world’s top companies and research labs.

Composed of nine nationalities and operating from hubs in France, North America, and Israel, we believe in great science and fast achievements. Our work is guided by these core principles:

1. Do great things: we deliver work we’re proud to sign our name to.

2. High velocity: speed matters. We move quickly, one step at a time.

3. One unit: we’re all in this together, with relationships grounded in trust, respect, and camaraderie.

Arago is backed by executives from Apple, Arm, Nvidia, Microsoft, and Hugging Face, as well as prominent US and European deeptech venture firms and exited founders.

What you’ll do

Play a critical role in the assembly, packaging, and integration of our next-generation optical chips, ensuring the physical integrity and performance of our core technology.

Required Skills and Experience

• Bachelor’s, Master’s, or PhD in Photonics, Electrical Engineering, Materials Science, Physics, or a related field.

• Proven hands-on experience with semiconductor assembly techniques, including wire-bonding and die-bonding.

• Direct experience with high-precision microfabrication or lithography systems.

• Familiarity with opto-electronic device packaging and fiber-to-chip alignment challenges.

• Experience working in a cleanroom or controlled laboratory environment.

• Strong problem-solving skills and meticulous attention to detail in a hands-on laboratory setting.

Responsibilities

• Perform high-precision die-bonding and wire-bonding for the assembly of opto-electronic chips and components.

• Operate and maintain our lithography system.

• Develop, optimize, and document novel assembly and packaging processes to improve yield, reliability, and performance.

• Collaborate closely with photonics and electronics design teams to provide DFA feedback.

• Conduct characterization and failure analysis of assembled packages to identify and resolve process issues.

• Maintain and calibrate key laboratory equipment, including bonding and lithography systems, to ensure operational readiness.

• Contribute to the strategic expansion of our lab's assembly and packaging capabilities.

Pay and benefits

• Competitive cash compensation, with final package based on location, experience, and the pay of team members in similar positions.

• Meaningful stock option plan offered at the earliest stage of the company (included in the majority of full time offers).

• Relocation bonus and coverage of moving expenses for relocation within 20 minutes of the company’s location.

• Healthcare coverage (including family-friendly options), pension contributions, professional development support, and 25 days of PTO, in addition to public holidays.

• Ownership of a key technical domain, with significant vertical and/or horizontal growth opportunities, based on performance and individual drive.

• A high-paced, multicultural (with 10 nationalities), and engineering-led environment.