Technical Support Engineer (TSE) III - SRP - (E3)

Technical Support Engineer (TSE)

TSEs provide technical support remotely, and on site, to FSO personnel for highly complex problems involving equipment malfunction, on wafer issues, and performance enhancement programs where first-line product support was unable to isolate or fix a problem. Using advanced troubleshooting methodologies, they establish success criteria, develop comprehensive action plans, analyze and compile findings, perform root cause analysis and support FSO repair activities through escalation closure.

Responsibilities include:

• Support multiple technical escalations, resolve with focus on time to resolution and quality of work
• Attend customer field issues meetings with FSO, collaborate with BU engineers
• Recommend best practices to improve products, processes, or services.
• Publishing Technical Lessons Learned, troubleshooting guides, technical (ET) papers, etc.
• Provide on-site coaching to FSO
• Provide Alpha and Beta Site support
• Support NPI development early in the product life cycle, and at key customer sites
• Support BU DFx (Design for Service / Install) projects
• Create, or collaborate in creation of, innovative advanced trouble shooting tools

Business Expertise: Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market.

Leadership: Provides coaching to colleagues with less experience; may lead small projects with manageable risks and resource requirements.

Problem Solving: Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information and data.

Impact: Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies.

Interpersonal Skills: Explains difficult or sensitive information; works to build consensus. Manage difficult situations in stressful environments.

Qualifications:

• Education: Bachelor's degree or equivalent in technical field
• Skills:
• Ability to work independently and as part of a team
• Strong organizational and time management skills
• Excellent interpersonal and communication skills
• Ability to handle stressful situations and effectively manage difficult problems
• Familiar with suite of Microsoft Apps, and internal ones such as SAP, VSPI, and ARK
• Certifications: Applied Materials Etch Product Certification or equivalent.
• Languages: English (written and verbal)
• Years of Experience: 3+ years of experience with Applied Materials SRP products or similar semiconductor equipment.
• Work Experience: Minimum 3 years of semiconductor fab HW experience

• Shift: Mon-Fri 8 hr per day
• Travel: Yes, generally 25% of the time, but could be as high as 50%.
• Relocation Eligible: No

Additional Information:

Time Type: Full time

Employee Type: Assignee / Regular

Travel: Yes, 25% of the Time

Relocation Eligible: No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.