Advanced Packaging Process Integration Principal/ Staff Engineer

Process Integration Principal/ Staff Engineer

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.

As a Process Integration Principal/ Staff Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies. In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT, Consumer and High-Performance Computing market segment. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions bringing them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and integration process flow development to make sure projects are completed successfully and delivered on time.

Responsibilities:

1. Develop 2.5D/ 3D process technologies and solutions for Advanced Packaging including Bump/ Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding
2. Plan wafer splits/ lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.
3. Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data to ensure meeting requirements such as yield, reliability.
4. Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.
5. Owns, manages, and drives technical programs/ project, report out timely status and interface with various stakeholders/management leading to completion.

Experience:

• At least 7 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/ Back-end of Line/ Packaging or Assembly.
• Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous.
• Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be advantageous.
• Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies.
• Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions.
• Demonstrate ability, experience, and good communication skills to work across different functions/ unit process owners and geographies to achieve technical outcome.
• Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering.