Wireless Power Electromagnetic & Thermal Fea Engineer
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Description
This is an opportunity to participate in a multifaceted and outstanding engineering group at one of the world's leading companies. In this role, you will tackle critical design challenges at the intersection of wireless power and thermal management. The ideal candidate will have a deep, co-equal understanding of both electromagnetics and thermal science to co-optimize for charging efficiency, power delivery, and thermal performance in highly constrained systems. The role requires broad knowledge of finite element analysis (FEA) and computational fluid dynamics (CFD) to create tightly coupled multi-physics models. This is a unique opportunity to design and deliver cutting-edge inductive power systems with mass production intent. Candidates with a creative attitude who are eager to solve complex multi-disciplinary problems will find this role especially fulfilling.
Responsibilities:
- Develop and analyze coupled electromagnetic and thermal models of various geometrical structures using FEA/CFD.
- Apply a deep understanding of conduction, convection, and radiation to predict and mitigate thermal challenges in compact power systems.
- Drive new techniques in multi-physics simulation and measurement for improved efficiency and accuracy.
- Conceptualize and analyze thermal management solutions (e.g., heat sinks, heat pipes, vapor chambers) in concert with electromagnetic components.
- Use analytical tools (e.g., MATLAB, Python, JMP) for system modeling, data processing, and statistical analysis of design perturbations.
- Perform electromagnetic and/or thermal analysis and verification of designs with Finite Element Analysis software (e.g., COMSOL Multiphysics, Ansys Maxwell/Icepak, Flotherm).
- Work with a cross-functional team of electrical engineers, mechanical designers, and material scientists to deliver an integrated solution.
- Execute experimental validation of designs, correlating simulations with measurements from both electrical and thermal lab equipment.
- Participate in material selection (magnetic, conductive, and thermal) through experimental and theoretical investigation.
- Rigorously document designs, simulation methodology, and key parameters.
Minimum Qualifications
- Deep, fundamental background in electromagnetics and a sound facility with Maxwell's equations.
- Equally strong foundation in heat transfer physics (conduction, convection, radiation) and fluid mechanics.
- Demonstrated experience with multi-physics FEA/CFD simulation tools (e.g., COMSOL, Ansys suite, Flotherm, etc).
- BS and a minimum of 3 years relevant industry experience
Preferred Qualifications
- Experience with transformer theory and inductive power link modeling.
- A thorough understanding of thermal management solutions including heat sinks, heat pipes, vapor chambers, and air movers.
- Proficiency with CAD tools (e.g., NX) and scripting languages (e.g., Python, Perl) for automation.
- Familiarity with common lab equipment for both electrical and thermal validation (e.g., network analyzers, LCR meters, power supplies, oscilloscopes, thermal cameras, thermocouples).
- Understanding of the physics of magnetic materials.
- Familiarity with manufacturing processes for coils, heatsinks, and other related components.
- Strong analytical/problem-solving skills and persistent attention to detail.
- Outstanding verbal, written, and interpersonal skills with an ability to thrive in a fast-paced, collaborative environment.
- Must be highly motivated and a self-starter with innovation, integrity, and attention to detail.
- M.S. with 5+ years of experience or Ph.D. with 3+ years of experience in Electrical Engineering, Mechanical Engineering, Engineering Physics, or a related field.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status, or other legally protected characteristics.