At Apple, we work every single day to craft products that enrich people's lives! Do you love creating elegant solutions to highly complex challenges? Do you intrinsically see the importance in every detail? As part of our Silicon Technologies group, you'll help design and manufacture our next-generation, high-performance, power-efficient processor, system-on-chip (SoC). You'll ensure Apple products and services can seamlessly and efficiently handle the tasks that make them beloved by millions. Joining our group means you'll be responsible for crafting and building the technology that fuels Apple's devices. Together, we will enable our customers to do all the things they love with their devices! In this highly visible role, you will be part of a critical team responsible for physical verification of an SOC.
As a member of our physical design team, you will perform various types of physical verification checks such as LVS, DRC, design-for-manufacturing, design-for-yield, and other lithography and electrical checks at the chip and block level. Responsibilities expected will include: - Driving full-chip physical verification flow methodology for Apple SoCs, starting from initial floorplanning phase through final tapeout. - Setup and validation of PDV flows for block and full chip levels, including optimizations in partnership with cross functional groups such as Technology and CAD teams. - Close collaboration with PNR, custom design, and IP teams to identify PDV issues starting from early milestones and drive solutions that optimize for PPA and efficient design closure. - Driving full chip implementation and verification methodologies for ESD protection strategies including digital, analog and mixed signal back-end design verification. - Serve as a technical expert and mentor within the organization, providing guidance on complex verification challenges and fostering the growth of early career engineers. - Proactively identify and address execution risks, communicate status clearly to leadership, and drive issues to resolution with a high degree of autonomy. - Cross functional collaboration with package, floorplan, and other analysis teams for padring, bump and RDL designs.
- Minimum BS and 10+ years of relevant industry experience. - Proficient with industry-standard EDA tools such as Mentor Calibre, and/or Synopsys ICV. - Experience with scripting skills in Python, Tcl, and/or Perl, calibre-SVRF through deployed automation or verification flows.
- Proven track record of taping out multiple complex SoCs in advanced tech-nodes. - Understanding of the device physics and how it applies to back-end verification challenges associated with advanced nodes, including complex design rules. - Experience in debugging and resolving highly complex LVS and DRC issues at the full-chip and block level. - Demonstrated ability to lead technical initiatives, mentor early career engineers, and drive methodologies from concept to production. - Experience with ESD protection strategies and digital, analog, and mixed signal design integration verification. - Experience with padring placement, Bump, RDL, and package design methodologies and verification checks. - Experience with industry-standard electrical analysis tools such as PERC, RedHawk, PathFinder, Totem, and/or Voltus used in ESD signoff checks. - Layout design experience.