Silicon Photonics Flip - chip Bonding Process Engineer

Silicon Photonics Flip-Chip Bonding Process Engineer

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, smart people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same passion for innovation that goes into our products also applies to our practices strengthening our commitment to leave the world better than we found it. Join us to help deliver the next groundbreaking Apple product! Do you love working on challenges that no one has solved yet? As a member of our dynamic group, you will have the unique and rewarding opportunity to craft upcoming products that will delight and inspire millions of Apple's customers every single day!

Description

Apple's Biophotonics team is seeking a Flip-Chip bonding process engineer to join their rapidly expanding silicon photonics group. This individual will work on the research and development of novel integrated photonics devices in sensing applications, being primarily responsible for day-to-day operation, reporting, and documentation of a high-precision flip-chip bonding process. As a key member of a multidisciplinary team working on the next generation of silicon photonics integrated circuits, this position will operate in a dynamic environment that demands a strong understanding of design specifications, deep knowledge of process capabilities and limitations, thorough data analysis, and exceptional communication skills.

Minimum Qualifications

• BS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field.
• Background in semiconductor process integration, particularly in the back-end section of the manufacturing process.

Preferred Qualifications

• 3+ years of relevant industry experience.
• MS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field, with a background in semiconductor processing/fabrication.
• Hands-on experience with die bonder tools and processes, or similar high precision assembly tool (flip-chip eutectic AuSn bonding experience beneficial).
• Experience working in a cleanroom environment setting.
• Strong problem solving ability and experience with material inspection, e.g. optical microscopes, metrology tools, etc.
• Electrical and optical test experience.
• Knowledge of statistical data analysis, with expertise in using relevant tools (e.g., JMP).
• Excellent communication skills, with the ability to work effectively in a team with diverse expertises.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status, or other legally protected characteristics.