As a Manufacturing Operator in the Wire Bond Department, you will be pivotal in packaging and assembling semiconductor devices. Your role involves working under a microscope for extended periods and following detailed written and verbal work instructions. You will run automated die attach and wire bond processes and perform manual and automated assembly of microelectronic devices. Training will be provided on-site for operating specialized equipment.
This contract-to-hire role is with a family-oriented company that values work-life balance. Employees have access to a new cafeteria with a pool table and snacks, fostering a relaxed and enjoyable workplace atmosphere.
This position is based in an ITAR facility requiring work in a cleanroom environment. The dress code includes full PPE such as gloves, lab coats, face masks, and shoe covers. The work hours are 7am to 3:30pm, Monday to Friday, promoting a regular schedule.
This is a contract to hire position based out of Escondido, California.
The pay range for this position is $22.00 - $24.00/hr. Eligibility requirements apply to some benefits and may depend on your job classification and length of employment. Benefits are subject to change and may be subject to specific elections, plan, or program terms. If eligible, the benefits available for this temporary role may include the following:
• Medical, dental & vision • Critical Illness, Accident, and Hospital • 401(k) Retirement Plan – Pre-tax and Roth post-tax contributions available • Life Insurance (Voluntary Life & AD&D for the employee and dependents) • Short and long-term disability • Health Spending Account (HSA) • Transportation benefits • Employee Assistance Program • Time Off/Leave (PTO, Vacation or Sick Leave)
This is a fully onsite position in Escondido, CA.
This position is anticipated to close on Sep 19, 2025.