Senior Staff Packaging Engineer

Lead Technology Development And Supply Chain Bring Up Of Advanced Substrate Technologies

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.

The role: Lead technology development and supply chain bring up of advanced substrate technologies to support AMD product roadmap.

The person: The candidate should have a proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate. He/she should have a hands-on approach to new process development with a deep knowledge of packaging and board design rules, process flows and materials. They should have excellent oral and written communication skills to communicate ideas and technology target requirements with suppliers, internal partners, product architects and AMD management.

Key responsibilities:

• Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors
• Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements
• Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks.
• Partner with product, quality and manufacturing engineering teams to meet various milestones for manufacturability, yield and reliability from concept through NPI.
• Qualify package substrates of new products meeting cost and yield targets.

Preferred experience: Five plus years of experience leading cross functional teams to achieve technology certification, yield/cost reduction initiatives Proven record of communicating complex technical challenges to executive level/management Prior experience working with international teams across various time zones.

Academic credentials: BS/MS/PhD in solid state physics, Chemistry, Material science, Chemical engineering or equivalent.

Location: Penang, Malaysia

Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.