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Packaging Engineer

Lead development of large module on substrate assembly technology in collaboration with industry partners
Hsinchu, Taiwan
Senior
9 hours agoBe an early applicant
Advanced Micro Devices

Advanced Micro Devices

Designs high-performance CPUs, GPUs, and adaptive computing solutions for PCs, data centers, gaming, and embedded applications.

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The Role

Main role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements.

The Person

This individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly.

Key Responsibilities

  • Drive OSAT to develop advance assembly technology capabilities to meet technology development deliverables.
  • Collaborate with integration and design teams to integrate assembly and design needs.
  • Formulate plans to enhance assembly capabilities to meet design needs.
  • Establish ecosystem partners to identify assembly capability improvement roadmap

Preferred Experience

In depth process knowledge of key advanced packaging processes Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience. Well verse in typical technology development tools, FMEA, SPC, control plans, etc.. Ability to communicate well in both English and Chinese language

Academic Credentials

Minimum Msc

Location

Taiwan Hsinchu

Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.

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Packaging Engineer
Hsinchu, Taiwan
Engineering
About Advanced Micro Devices
Designs high-performance CPUs, GPUs, and adaptive computing solutions for PCs, data centers, gaming, and embedded applications.