Engineer II - Component Failure Analysis

Engineer II - Component Failure Analysis

POSITION SUMMARY:

Supports the product level FA and NPI. Perform product level root cause analysis and identify the program is due to component, testing setup, handling, workmanship or design weakness. Provides technical support and verify the board and product level test is properly executed. Performs data monitoring and develops golden sample to ensure the testing setup is consistent. Analyses the data from production repairman, tackles the weekly top defect that reported by repairman. Supports the RMA root cause analysis.

RESPONSIBILITIES:

1. Plan the analysis step.
2. Based on the background information and application-level analysis result to identify the possible cause of failure, then define the FA plan.
3. Design the deep level FA plan based on the nondestructive or preliminary analysis result.
4. Design component or subassembly level screening and try to reduce risk at product level.
5. Review the CFA report.
6. Verify the conclusion from CFA report that further study any risk or overstress problem at product level.
7. Support the revision of the FA plan and evaluation test content, if not able to find out possible root cause.
8. Participate in the meeting with field application engineer and customer to understand the background of failure and explain the possible cause.
9. Participate in the meeting with supplier to review the root cause analysis and related preventative action.
10. To provide technical support to factory.
11. To provide method to verify or analyze the hidden potential quality problem inside product, such as, test coverage of PCBA from subcontractor; thermal stress analysis for the component inside PCBA.
12. Advice the possible solution and detect method on specific process issues or quality improvement to factory.
13. To assist Program/Quality Team in providing feedback to customer on NPI analysis result that come from new process or reliability evaluation.
14. Adhere to organizational requirements on quality management, health and safety, code of conduct, legal stipulations, environmental, 5S policies and general duty of care.
15. Other duties as assigned.

QUALIFICATIONS:

• Able to explore and evaluate new process technologies.
• With strong communication skills to handle communication with internal and external parties.
• Organized project planning skills.
• Problem solving.
• Data analysis.
• Knowledge for power semiconductor device, PCB, plastic material properties and passive component.

EXPERIENCE:

• Well understanding of power and RF electronic circuitry operation and related test equipment operation.
• Design and develop the test circuit and fixture for component and related reliability test.
• Good data analysis skills, SPC, PowerBI, test equipment to remove control and programming.
• Experience in electronic circuit analysis, semiconductor and PCBA manufacturing process and FA knowledge.

EDUCATION:

• Bachelors Degree in Power/Micro-Electronic Engineering, or equivalent education and/or experience.