AWS Utility Computing (UC) provides product innovations — from foundational services such as Amazon's Simple Storage Service (S3) and Amazon Elastic Compute Cloud (EC2), to consistently released new product innovations that continue to set AWS's services and features apart in the industry. As a member of the UC organization, you'll support the development and management of Compute, Database, Storage, Internet of Things (Iot), Platform, and Productivity Apps services in AWS. Within AWS UC, Amazon Dedicated Cloud (ADC) roles engage with AWS customers who require specialized security solutions for their cloud services.
The SIP (Signal-Integrity & Packaging) team is part of Annapurna-Lab's Chip development team. The team is dealing with the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives. The team's work includes close work with the BackEnd team on integrating these interfaces to the Die, the package layout design of the BGA's substrate, Signal and power integrity simulations, and working with the system team to come up with optimal pin-out and optimal PCB breakout schemes.
We are looking for highly motivated Electrical Engineering graduates, or engineers with up to 3 years' experience in related fields, to join our growing team specializing in Signal Integrity and IC Package Design. The position offers a unique entry point into a diverse and multidisciplinary domain.
Key job responsibilities:
You will undergo a comprehensive training program, providing you with the essential knowledge and skills required to succeed in this field. The work is multidisciplinary, bridging physical design, electromagnetic theory, and practical engineering challenges.