Amazon LEO is an initiative to increase global broadband access through a constellation of 3,236 satellites in low Earth orbit (LEO). Its mission is to bring fast, affordable broadband to unserved and underserved communities around the world. Amazon LEO will help close the digital divide by delivering fast, affordable broadband to a wide range of customers, including consumers, businesses, government agencies, and other organizations operating in places without reliable connectivity.
As an Hardware Engineer, you will have the opportunity to work on some of the most innovative, challenging, and exciting phased array antenna systems in industry right now. You will engage with an experienced team to conceive and design phased arrays aimed at delighting customers with affordable, reliable, high bandwidth connectivity. You will work closely with Amazon Leo's various sub-teams and engage third party suppliers to drive product definition, design, optimization, implementation, and test. The Hardware Engineer will have a complete understanding of how their design changes impact downstream partners such as operations, supply chain, product management, and reliability.
Amazon strongly believes in Ownership and you will have the opportunity to own your designs from concept through production. You will own or contribute to the following:
Export Control Requirement: Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
About the team The payload antenna team is responsible for the architecture, design, implementation, validation, qualification, and new product introduction to manufacturing for all satellite phased arrays. These antenna systems will meet performance requirements defined by the RF/modem team as well as environmental and reliability requirements defined by the mechanical team. To this end, the antenna team collaborates closely with all the partner teams including silicon, power, mechanical, thermal, modem, RF/Coms system, and SW teams.